Abstract




 
   

IJE TRANSACTIONS C: Aspects Vol. 27, No. 3 (March 2014) 475-486   

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  ANALYTICAL SOLUTION OF STRESS FIELD IN ADHESIVELY BONDED COMPOSITE SINGLE-LAP JOINTS UNDER MECHANICAL LOADINGS
 
E. Selahi, M. Tahani and S. A. Yousefsani
 
( Received: February 27, 2013 – Accepted: August 22, 2013 )
 
 

Abstract    In this paper, considering an adhesively bonded composite single-lap joint, a novel approach is presented to predict the peel and shear stress distributions of the adhesive layer for an ASTM standard test sample. In current method, the equilibrium equations are derived using the energy method and based on the Timoshenko’s beam theory. Two solution procedures then are discussed, one of which represents a solution approach based on the direct variational method allied with use of the Ritz approximation; while the second one is based on a linear estimating function. Unlike previous methods, in which the variation of stress through the thickness of adhesive is neglected or is assumed to be linear and they cannot be used to analyze the joints with thick adhesive layers; considering the effects of adhesive thickness makes it possible to employ present method to analyze the joints with thick adhesive layers as well as thin ones.

 

Keywords    Adhesive Bonding, Composite Joint, Interlaminar Peel and Shear Stress, Analytical Solution, Energy Method

 

چکیده    در اين مقاله، روشي جديد براي پيش بيني توزيع تنش های ميان لايه ای عمودي و برشي در لايه چسب اتصالات چسبي کامپوزيتي تک-لبه معرفي گرديده و نتايج تحليل براي يک نمونه استاندارد ASTM ارائه مي شود. در اين روش، معادلات تعادل با استفاده از روش انرژي و بر اساس تئوري تير تيموشنکو استخراج مي گردد. در ادامه دو روش حل معرفي مي شود که يکي از آن ها پاسخ را بر اساس روش حساب تغييرات مستقيم و تقريب Ritz به دست مي دهد؛ درحاليکه روش دوم بر پايه يک تابع تخميني خطي استوار است. برخلاف روش هاي پيشين، که در آن ها از تغييرات تنش در راستاي ضخامت چسب صرفنظر شده و يا اين تغييرات به صورت خطی درنظر گرفته مي شود و از اين رو، قادر به تحليل اتصالات با لايه چسب ضخيم نيستند، روش حاضر با در نظر گرفتن اثرات ضخامت لايه چسب، امکان تحليل اتصالات با لايه چسب ضخيم و نازک را فراهم مي آورد.

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